Established in 1996, FlipChip International is a leading supplier of wafer level packaging and flip chip bumping products and services. The company offers patented wafer level chip scale package UltraCSP and provides processing services for all types of silicon and germanium wafers. As a wholly owned subsidiary of RoseStreet Labs, FlipChip International also offers a variety of services including Standard Flip Chip, Spheron and EliteCSP, as well as inspection, interface analysis, and material characterization services. Additionally, the company specializes in laser marking, background coating, and electronic wafer yield mapping services.
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